DS-MPE-GPIO 36 Channel Digital I/O PCIe MiniCard
Diamond Systems
The DS-MPE-GPIO is a rugged, low cost 36-channel digital I/O PCIe MiniCard module that is ideal for digital I/O expansion in embedded and OEM applications.
We provide various sizes of embedded boards from Pico-ITX to 5.25” SBC and can meet different applications involving data acquisition, video processing, telecommunication, networking, motion control plus the associated field wiring termination, I/O circuit protection, etc.
The DS-MPE-GPIO is a rugged, low cost 36-channel digital I/O PCIe MiniCard module that is ideal for digital I/O expansion in embedded and OEM applications.
The DS-MPE-SER4M is a rugged, low cost 4-port high speed PCIe MiniCard module that is ideal for serial I/O expansion in embedded and OEM applications.
The DS-MPE-SER4OPT is a rugged, low cost 4-port opto-isolated PCIe MiniCard serial module that is ideal for serial I/O expansion in embedded and OEM applications where opto-isolation is needed for safety or for ground loop prevention.
Rugged Chassis for Mobile Military Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military/Aerospace Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military/Aerospace Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military/Aerospace Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military/Aerospace Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military/Aerospace Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military/Aerospace Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged Chassis for Mobile Military Applications
Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses. Environmentally Sealed Enclosure for Conduction-Cooled modules.
Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses. Environmentally Sealed Enclosure for Conduction-Cooled modules.
Rugged Chassis for Military and other Harsh Environment Applications. Two Standard 3U CompactPCI or VPX Slots.
Rugged 2 Slot, 3U CompactPCI Chassis for Mobile Military Applications. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged 2 slot, 3U CompactPCI Powered Enclosure. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Rugged 4 slot, 3U CompactPCI Powered Enclosure. Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses.
Four Standard 3U VPX Slots. Rugged Chassis for Military and Other Harsh Environment Applications.
RFID Smart Module
Plug-and-Play RAIN® RFID Finished Reader